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IRS2101(S)PbF
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
Symbol
V B
V S
V HO
V CC
V LO
V IN
dV S /dt
Definition
High - side floating supply voltage
High - side floating supply offset voltage
High - side floating output voltage
Low - side and logic fixed supply voltage
Low - side output voltage
Logic input voltage (HIN & LIN)
Allowable offset supply voltage transient
Min.
-0.3
V B - 25
V S - 0.3
-0.3
-0.3
-0.3
—
Max.
625
V B + 0.3
V B + 0.3
25
V CC + 0.3
V CC + 0.3
50
Units
V
V/ns
P D
Rth JA
T J
T S
T L
Package power dissipation @ T A ≤ +25 ° C
Thermal resistance, junction to ambient
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
(8 lead PDIP)
(8 lead SOIC)
(8 lead PDIP)
(8 lead SOIC)
—
—
—
—
—
-55
—
1.0
0.625
125
200
150
150
300
W
° C/W
° C
Recommended Operating Conditions
The input/output logic timing diagram is shown in Fig. 1. For proper operation the device should be used within the
recommended conditions. The V S offset rating is tested with all supplies biased at a 15 V differential.
Symbol
V B
V S
V HO
V CC
V LO
V IN
T A
Definition
High - side floating supply absolute voltage
High - side floating supply offset voltage
High - side floating output voltage
Low - side and logic fixed supply voltage
Low - side output voltage
Logic input voltage (HIN & LIN)
Ambient temperature
Min.
V S + 10
Note 1
V S
10
0
0
-40
Max.
V S + 20
600
V B
20
V CC
V CC
125
Units
V
° C
Note 1 : Logic operational for V S of -5 V to +600 V. Logic state held for V S of -5 V to -V BS . (Please refer to the Design
Tip DT97-3 for more details).
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